※ Customer Information

Customer Name :		Company :
Phone :		E-mail :
Fax :

※ Dimensions

A..Length :	± mm
B..Width :	± mm
C..Thickness :	± mm

※ Process Flow

: Please outline a general overview of the flow for your device

※ Features

A.	Minimum featurs size :
B.	Minimum feature separation :

※ Metallization(evaporation)

A.	Metallization required : Yes    No
B.	Number of metallizations :
C.	Type of metallization :
	Layer 1 Layer 2 Layer 3 Layer 4 Material Thickness
D.	Backside metal : Yes    No
	Define layer definition if required

※ Au/Sn Solders

A.	Solders required : Yes    No
B.	Solder composition :
C.	Thickness : as deposited
D.	Gold metallization thickness on the part to be attached to the solder :

※ Pits & Grooves

A.	Width :
B.	Depth :
C.	Groove intersection : Yes    No

※ Order (check as needed)

Ball lenses			Lasers
lsolator			TIA
PIN			m-PD
Capacitors

※ Dielectric Films required

A.	Oxide : Yes    No Thickness :
B.	Nitride : Yes    No Thickness :
C.	Wet thermal oxide : Yes    No Thickness :
D.	LTO : Yes    No
E.	Other : Yes    No Thickness :
	Define :

※ Prototyping Quantity(Pcs)

※ Delivery

※ Annual Volume Predictions

※ Add File